CDNA 3 refresh: HBM3E in the same OAM envelope as MI300X.
Mid-cycle bump on CDNA 3 — 256 GB HBM3E and 6 TB/s of memory bandwidth at 1000 W TBP. Same FP8/BF16/FP16 throughput as MI300X; the win is fitting larger models per OAM and per 8-GPU node.
Specs
vram gb
256
compute
CDNA 3
tdp watts
1000
bandwidth gbps
6000
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